Abstract: The slag of copper smelting is a kind of important secondary metal resource. The slag phase investigation about the electro-capillary migration of metal droplet in the copper smelting slag was carried out. The results show that the process of copper droplets migration and accumulation in the slag is not obvious without electric field, and they are randomly distributed in the slag. But that process will be increased in the presence of external electric field. The quantity and size of copper droplet is larger at cathode than at anode, and the copper would be concentrated in a particular area of cathode. The radius of copper droplet in the slag will increase with the time increase of holding temperature, they finally presented round shape.

Key words: Copper slag, Electro-capillary migration, Copper droplet, Micro-examination